Seoul: The head of Samsung Electronics' memory business announced a significant meeting with Nvidia CEO Jensen Huang, focusing on long-term cooperation in next-generation high-bandwidth memory (HBM) products. Jun Young-hyun, who leads Samsung's device solutions division, disclosed these discussions to reporters following his meeting with Huang, who was visiting South Korea to engage with industry leaders in the AI ecosystem.
According to Yonhap News Agency, the discussions centered on collaboration in next-generation HBM technologies, such as HBM4E and HBM5, and potential cooperation in the foundry business. HBM chips are pivotal in modern AI systems, working alongside AI processors to deliver the extensive bandwidth required for AI training and inference.
Jun emphasized Samsung's commitment to supplying sufficient HBM4 products to Nvidia, a key player in the global AI accelerator market, in the near term. The meeting underscores Samsung's intent to bolster its presence in the burgeoning HBM market, fueled by AI data center expansion and the emergence of more powerful AI models.
When asked about Nvidia's reliance on SK hynix, Samsung's rival, as its primary memory partner, Jun expressed confidence in Samsung's capabilities. He stated that the company will "work hard on what we do" and demonstrate its strengths through tangible results.