Seoul: SK hynix Inc. announced on Wednesday that it has dispatched samples of its next-generation 12-layer high bandwidth memory (HBM4) to key customers, marking a global first in the industry. These samples were delivered ahead of schedule, showcasing SK hynix's technological prowess and production experience that have positioned it at the forefront of the HBM market. The company is now poised to begin the certification process with its customers.
According to Yonhap News Agency, while SK hynix has not disclosed the identities of these customers, it is widely speculated that major U.S. technology firms, including AI leader Nvidia Corp., are among them. SK hynix aims to finalize preparations for mass production of the 12-layer HBM4 products within the second half of the year. Presently, the company leads the HBM market with its fifth-generation HBM3E products, which are pivotal in graphics processing units (GPUs), a sector largely dominated by Nvidia.
In conjunction with the shipment, SK hynix showcased the 12-high HBM4 samples and a small outline compression attached memory module (SOCAMM)-a low-power DRAM-based memory module optimized for AI servers-at GTC 2025, an annual tech conference hosted by Nvidia. The event, which began on Monday and spans five days in California, features SK hynix presenting its cutting-edge memory solutions under the theme "Memory, Powering AI and Tomorrow."
At the conference, SK hynix's exhibition focuses on its HBM and other memory products tailored for AI data centers, as well as on-device and automotive business memory solutions vital for the AI era. SK hynix's leadership team, spearheaded by CEO Kwak Noh-jung, is set to engage with global AI industry leaders during GTC 2025, aiming to strengthen collaborations and explore future opportunities in AI-driven memory technology.