Samsung and Nvidia Collaborate on Next-Gen HBM4 Supply for AI Expansion


Gyeongju: Samsung Electronics Co. has announced its collaboration with U.S. technology leader Nvidia Corp. to supply next-generation high bandwidth memory (HBM) chips, as both companies seek to strengthen their partnership in the artificial intelligence (AI) sector. This announcement was made during the Asia-Pacific Economic Cooperation (APEC) CEO Summit in Gyeongju, approximately 275 kilometers southeast of Seoul.



According to Yonhap News Agency, Nvidia revealed its intention to supply its latest Blackwell graphic processing units (GPUs) to South Korean companies, including Samsung. This move is part of a broader strategy to integrate Nvidia’s advanced technology into Samsung’s operations. Samsung emphasized its ongoing collaboration with Nvidia, highlighting the role of HBM4 in their joint efforts.



Samsung’s advanced HBM solutions are designed to enhance the development of future AI applications by providing high bandwidth and energy efficiency. This technology is crucial for AI servers, where demand is growing due to its ability to significantly increase data-processing speeds in data centers. Samsung is committed to delivering not only HBM but also other memory solutions such as GDDR and SOCAMM, alongside foundry services, to Nvidia. This is part of a broader initiative to enhance cooperation along the global AI value chain.



In addition to these efforts, Samsung disclosed plans to establish a new AI-powered factory in collaboration with Nvidia. This facility will utilize over 50,000 Nvidia GPUs to embed AI throughout Samsung’s manufacturing processes. The initiative aims to accelerate the development and production of next-generation semiconductors, mobile devices, and robotics, further solidifying the partnership between the two tech giants.