Onyang:Seoul Samsung Electronics Co. Chairman Lee Jae-yong announced plans to transform the company's semiconductor operations in Onyang, South Chungcheong Province, into a significant hub for advanced chip packaging, specifically high-bandwidth memory (HBM).
According to Yonhap News Agency, Lee made the announcement during a groundbreaking ceremony for a new production facility. This development is part of a government initiative aimed at establishing the central Chungcheong region as a global center for artificial intelligence-driven innovation.
The company intends to invest a total of 46 trillion won (approximately US$34.5 billion) in the Onyang campus to construct five HBM production lines. This investment includes 6 trillion won for construction costs and 40 trillion won for advanced equipment, which will be introduced in phases.
The new facility, which will feature a cleanroom covering 31,000 square meters, is the site's fifth production line and will be dedicated to advanced HBM production. The three-story plant is scheduled to commence operations in June 2028.
Upon completion, the campus' total floor space will increase from 270,000 square meters to 420,000 square meters. Additionally, the facility is expected to create approximately 700 direct jobs.